The same benefits as TQFP, in a smaller package
Amkor offers a broad line of LQFP (Low-profile Quad Flat Package) IC packages designed to provide the same great benefits as TQFP packaging with a 1.4 mm body thickness. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs and thin end‑product profile.
- 7 x 7 mm to 28 x 28 mm body size
- 1.4 mm body thickness
- 32–256 lead counts
- Pre-plated frame options
- Inverted pad configuration
- Cu, Ag and Au wire available
- Large selection of die pad sizes and custom leadframe design available
- Optimal for stacked die
Contact an Amkor expert by clicking the request info button below.