The same benefits as MQFP, in a smaller package

Amkor offers a broad line of Low Profile Quad Flat Packages (LQFP) designed to provide the same benefits as a Thin Quad Flat Package (TQFP) with a 1.4 mm body thickness.

Amkor’s LQFP allows customers to focus on meeting requirements related to increasing board density, die shrink programs, thin end-product profile and portability. LQFP packages are ideal for most IC semiconductor technologies including microcontrollers and ASICs. These packages are valuable for electronic systems requiring broad performance characteristics. Applications include PCs, video/audio, storage and communications, automotive andindustrialcontroller ICs.


  • 7 x 7 mm to 28 x 28 mm body size
  • 1.4 mm body thickness
  • 32–256 lead counts
  • Pre-plated frame options
  • Inverted pad configuration
  • Cu, Ag and Au wire available
  • Large selection of die pad sizes and custom leadframe design available
  • Optimal for stacked die
  • Pb-free和通过无铅认证材料


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