Improved cost management with gold alternatives

Silver (Ag) alloy and Copper, Palladium Coated Copper (PCC) wires have emerged as alternatives to gold bond wires. Silver alloy offers properties like those of gold with a cost similar to PCC. Copper wire offers a significant cost advantage over gold and is an excellent replacement due to similar electrical properties.

Features & Benefits

  • Silver wire is softer than PCC resulting in lower Al-Splash and lower risk of bond pad damage
  • Silver wire has a wide process window that improves manufacturability for devices with fragile bond pad structures
  • A low-cost replacement for applications that need:
    • Die-to-die bonding, waterfall bonding
    • Ultra-fine bond pad pitch (BPP) and small bond pad openings (BPO)
    • Ultra-low loop height

Copper Wire Bond Key
Features & Benefits

  • Significant cost advantage over gold wire
  • Excellent replacement for gold wire due to similar electrical properties
  • Self-inductance and self-capacitance are nearly the same for gold and copper wire
  • Lower resistivity
  • Where resistance due to the bond wire can negatively impact circuit performance, copper wire can offer improvement


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