Optimal performance in IC packaging

SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry-standard package runs in very-high volume and provides value-added, low-cost solutions for a wide range of applications.

Features

  • Copper wire interconnect for low cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkeytest service, including strip test option
  • Green materials are standard – Pb-free and RoHS compliant
  • Stealth dicing (narrow saw streets)
  • Larger/higher density leadframe strips
  • Leadframe roughing for improved MSL capability

Questions?

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