万博体育max官网手机版职业 - 中国

工作机会

业务发展经理

Duties & Responsibilities:

• Develop new biz from emerging Mobile, Communication (4G/5G) or Automotive markets in Greater China
• Define & execute growth strategy
• 开发市场情报和Osat动态报告
• Be contact window of Greater China, interface to HQ BU and support field Sales team

资格：

• 学士/硕士学位电气工程或材料科学
• More than 5 years of Marketing/Sales/FAE/PM working experience
• 熟悉中国移动/通信/汽车生态系统/客户群
• 狗万滚球官网半导体IDM / IC Fabless / Osat背景是首选
• 良好的英语水平

工艺工程师

Duties & Responsibilities:

• Sustain and/or optimizing process-yields and process-quality of the products through process improvement programs (SPC) and process monitoring (process capability-SPC) on production-lines. This includes data collection, analysis, and charting of process monitoring
• Responsible in evaluating, establishing, qualifying, and implementing of manufacturing process to production (due to changes in processes, materials, equipment & tooling)
• Qualify new materials, tooling, equipment ,new devices/packages and generation of specification, work-instruction, and procedures for production. This include BOM verifications and validations
• Analyze and disposition of abnormality or low yield lots. This also includes disposition of questionable (MRB) materials
• Recommend, evaluate and procure new equipment/material as part of cost reduction programs enhancing company’s competitiveness through higher output and lower cost
• 支持和解决生产线流程相关问题

Requirements:

• Preferably Degree in Electrical/Electronics, Mechanical, Chemical, Physics and above
• >1 year experienced process engineer from semiconductor factory
• Knowledge of quality tools and problem-solving skills, such as ISO9001 & IATF16949, SPC, MSA, FMEA, APQP, Control plan, PPAP, 8D, QC 7 tools, DOE, FA & Rel, MRB
• CET–4, basic knowledge of 6-Sigma

有兴趣的候选人可以发送他们的简历ATCRecruit@www.changhe-china.com

测试开发工程师

Duties & Responsibilities:

• Develop test solution on the Flex/J750/T2000/V93000 (includes VB/C++ programming) for Digital, Mixed Signal, High Speed and RF application devices
• Perform test program optimization /correlation to reduce COT and increase fault coverage
• 在解决方案规划中为客户提供技术专长。需要表现出快速理解新概念的能力，并将这种理解应用于利用现有的ATE仪器的可行解决方案
• 执行DUT板设计并为客户提供DUT板设计
• Be Interface and communicate with account teams, relevant divisions, sales force and customers to ensure project deliveries meet specification and customer expectation

资格：

• 电子工程，微电子，RF /微波工程或相关学科学士学位。需要硕士学位
• 至少3年以3年以上的ATE系统测试开发经验
• VB，C / C ++编程技巧
• 发言，阅读和写作的流利英语能力
• Proven Project Management skills
• 积极主动，自律和高度动力的自动启动器
• Good communication & strong team contributor

有兴趣的候选人可以发送他们的简历ATCRecruit@www.changhe-china.com

技术方案经理 - TPM（深圳）

Duties & Responsibilities:

• Coordinate customer qualifications of Amkor Technology factories and services
• 协调执行公认的客户特定的技术计划或要求
• 管理日常，战术技术问题
• 与关键客户技术人员开发和维护关系
• Promoting Amkor Technology capabilities, processes, and services
• Supporting the Account Manager related approval process
• Managing the resolution of customer specific manufacturing process, material quality or reliability problems
• Collecting and communicating our customer’s long-range technology roadmaps and providing the information to the appropriate groups
• Work with the Account Managers to drive the company to support those future customer requirements that are in line with
• Amkor strategic imperatives
• 协助与工厂，产品组协调客户审核/访问
• 提高半导体技术，制造和流程的个人知识狗万滚球官网

Travel Required:

• Domestic 30% International 5%

资格：

• University degree in material, electricity, mechanics, physics or electronics related
• More than 7 years’ experience in IC or Fab industry, especially familiar with FCBGA will be a plus
• 有设计或研发体验
• 有项目管理经验
• Have customer quality issue release experience

有兴趣的候选人可以发送他们的简历ATCRecruit@www.changhe-china.com

设计工程师

工作总结:

负责完成包装设计（引线框架/层压板/ WLCSP和Bumping产品）and associated support documentation. To partake in daily communications with customers, factory personnel, suppliers, and design/characterization team members to ensure the successful execution and completion of design projects and R&D support programs.

Duties & Responsibilities:

• 负责完成包装设计（引线框架/层压板/ WLCSP和Bumping产品）
• Responsible for associated support documentation
• 参与与客户，工厂人员，供应商和设计/特征团队成员的日常通信，以确保成功执行和完成设计项目和研发支持计划
• 由主管分配的其他职责

Travel Required:

• 国内5％国际0％

资格：

• 学士学位，在工程专业相关
• More than one year working in semiconductor process field
• Know about the relative basic semiconductor package procedure
• 计算机操作技能和设计工具
• Good verbal and written English communications are required for interactions with external and internal customers