Putting the latest packaging technologies to work for you

Innovation in semiconductor design and manufacturing is enabling smaller device architectures with higher performance and more energy-efficient devices found in virtually every market segment. From automotive to communications, computing, consumer, industrial, IoT, networking and artificial intelligence, Amkor is leading the way.

Artificial Intelligence

Explore packaging opportunities for Artificial Intelligence applications

Automotive

Amkor – the world’s largest OSAT for automotive ICs

Communications

Packaging matters, starting at the device packaging level

Computing

Advanced packaging technologies for a variety of computing devices

Consumer

Packaging to meet the demands of consumer electronics

Industrial

Meet complex market needs with extensive package offerings

Internet of Things

Amkor’s packaging provides solutions for today’s IoT designs

Networking

Packaging solutions to solve networking application challenges

Looking for technical information?

Amkor Datasheets

Data Sheets

Amkor Brochures

Brochures

Amkor White Papers

White Papers

Amkor Articles

Articles