Lightweight and thin package solution

Amkor’s broad line of Thin Quad Flat Packages (TQFPs) is well suited for customers that require reliable, cost-effective packages that are well established in the semiconductor industry. A wide range of body sizes and lead counts make this a versatile solution for many applications. Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, gate arrays (FPGA/PLD), microcontrollers and PMIC controllers. TQFP packages are particularly well suited for electronic systems applications requiring broad performance characteristics, including: computing, video/audio, telecommunications, data acquisition, communication boards (Ethernet, ISDN, etc.), set-top box and automotive.


  • 5 x 5 mm to 20 x 20 mm body size with 1.0 mm body thickness
  • 32–176 lead counts
  • Broad selection of die pad sizes
  • Pre-plated leadframes available
  • Inverted pad configuration available
  • Custom leadframe design available
  • Cu, Au and Ag wire options available
  • Pb-Free and RoHS compliant materials


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