Offering design flexibility for medium power applications
The HSON8 package maintains the same footprint area (5 x 6 mm) as the standard SOP8 package. HSON8 features an exposed die pad to enhance thermal performance. The HSON8 is suitable for medium-power applications (reference values 80W*/60A), designed for low on-resistance and high-speed switching MOSFETs.
Features
- Al wire bonding
- Plating coverage at the tip of the lead is more than 50% of the leadframe thickness
- Full turnkey available from wafer saw through test and packing
- Green materials: Pb-free plating and halogen-free mold compound
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