Thank you for visiting us at IMAPS DPC!
Below are the related documents to topics Amkor presented at the conference.
产品手册
Amkor has a broad product and technology offering allowing us to be a single source for our customers’ total IC packaging requirements
DSMBGA Data Sheet
Double Sided Molded BGA allows molded assembly of components on both sides of the substrate
有问题？
点击下方的 “获取信息“ 按钮，
联系 Amkor 专业人士。