Thank you for visiting us at IMAPS DPC!
Below are the related documents to topics Amkor presented at the conference.
Product Line Card
(제품 라인 카드)
Amkor has a broad product and technology offering allowing us to be a single source for our customers’ total IC packaging requirements
DSMBGA Data Sheet
Double Sided Molded BGA allows molded assembly of components on both sides of the substrate
Q & A
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