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Below are the related documents to topics Amkor presented at the conference.

Amkor Corporate Overview

Corporate Overview Brochure

Where technology, capacity and service come together to enable the future of electronics

Amkor Product Line Card

Product Line Card

Amkor has a broad product and technology offering allowing us to be a single source for our customers’ total IC packaging requirements

Amkor Test Services

Test Services Brochure

If you can build it, Amkor can test it!

Amkor Automotive Brochure

Automotive Brochure

Amkor – the world’s largest OSAT for automotive ICs

Amkor Flip Chip

Flip Chip Data Sheet

Packaging solutions to meet various application needs

FCBGA Data Sheet

Design flexibility for a wide range of end applications

System in Package

System in Package Data Sheet

Ideal solutions for low cost integration at a smaller size

Amkor DSMBGA Package

DSMBGA Data Sheet

Double Sided Molded BGA allows molded assembly of components on both sides of the substrate

Amkor WLFO Wafer Level Fan-Out

WLFO Data Sheet

Flexibility to enable 3D multi-component package designs

Amkor WLCSP Wafer Level CSP

WLCSP Data Sheet

Enable higher semiconductor content in a high performing, small sized package

AiP AoP

AiP/AoP Data Sheet

Cutting-edge solutions for 5G applications

Amkor Optical Packaging

Optical Sensors
Data Sheet

Amkor is the world leader in optical sensor packaging technology

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