利用外包测试服务

January 7, 2021 inSemiconductor StorybyVineet Pancholi
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解决5G、AI和汽车产品等领先IC市场的测试挑战

近年来,在当今竞争激烈的商业世界中,商业模式已转向“服务”。微软、亚马逊和谷歌等公司都是主要的成功案例,它们通过支持商业的服务推动了行业的发展。这些经济生产力改进服务使客户能够专注于产品架构、设计和快速上市。反过来,服务提供商公司也显示出了可观的经济效益,并在很大程度上实现了盈利。

在集成设备制造商(IDM)的世界里,类似这样的服务提供商几十年来一直使业界受益匪浅。Amkor Technology是一家老牌公司,50多年来一直为所有IDM(包括老牌和初创企业)提供创新的组装和测试服务。狗万注册地址

图1:Test is located at the back end of the manufacturing process.

To serve the diverse needs of world-class semiconductor manufacturers, Amkor offers more than 3000 different package formats and sizes. Packages range from traditional leadframe ICs for through-hole and surface mounting, to those required in high pin count and high-density applications such as stacked die, wafer level, MEMS, optical, flip chip, Through Silicon Via (TSV) and 3D packaging.1此外,几十年来,已为所有组装的产品和其他IC提供IC测试服务。因此,每年为客户测试数十亿个单位。

Product life

通常,有两个产品应用类别。第一类不是不断增加的带宽的关键路径。这些产品具有更长的生命周期,并在多种应用中找到自己。示例包括转换器(数模和模数转准),FET,传感器和较慢的速度小型串行存储器。第二类包括微处理器或CPU,图形处理单元(GPU),人工智能(AI)处理器,应用处理器(APU),内存控制器和调制解调器等技术驱动程序。这些产品具有较短的应用程序生活,须遵守摩尔定律。2虽然产品数量相对较高,这取决于应用程序(例如,手机连接率),但这些产品通常会根据客户的业务案例和需求进行重新架构和重新设计。

Test steps

The typical and minimum manufacturing test flow is shown in Figure 2.

图2:总体(典型)制造测试流程。

这些测试步骤中的每一个都具有独特的目的,并且是制造测试过程的一个组成部分。近年来,系统级测试(SLT)由于较高,块级集成到包装(SIP)中的系统中的较高,块级集成而增加了普及。作为高级SIP的创新领导者,定制的SLT技术允许在其最终使用应用环境中进行测试。虽然制造的ICS的测试主要是业务决策,但由于在市场上的最终客户提供降级的产品,缺乏或测试不足可能导致业务损失。

Osat优势与挑战

Amkor and the OSAT industry depend on automatic or automated test equipment (ATE) manufacturers for testers, probers, handlers and tooling. Manufacturers like Advantest, Teradyne, Cohu, National Instruments, TechWing, Chroma and many others provide the solutions. Unfortunately, test and measurement instrument developers lag the IDMs that develop the products. Design for Excellence (DFX) test methodologies for these products are also typically offered much later in the product maturity cycle. Amkor works closely with both customers and ATE suppliers to ensure production test capabilities are ready for new product introduction and volume manufacturing.

许多IDM已经意识到外包制造步骤的好处,如图1所示。随着时间到市场的压力,客户要求快速交钥匙测试流程,而不损害测试内容覆盖率和质量。

Amkor的测试活动的合理分数解决了行业领先的IC业务趋势,包括5G,人工智能和先进的汽车市场。每个市场都有自己独特的产品测试要求。例如,5G通常是指无线标准,其承诺增加超过4G限制的数据吞吐量。频谱FR1和FR2载波频带中的手机应用更高的带宽和更低延迟已经驱动了开发新的测试仪表,该测试仪表在传统的RF子系统载波频率高于上方。具有载波频率的RF子系统测试仪限制为6 GHz和160 MHz的带宽和增加的功率水平已经为测试行业提供了两十年来。

人工智能(AI)和机器学习(ML) applications are projected to dominate the introduction of newer instruction sets within processors requiring increasing processing power and inter-IC data communications at higher and higher digital data rates. These high-speed digital interfaces include but are not limited to display, memory, chipset I/O and Ethernet technologies. In the automotive market, product volumes and testing complexity have increased. In-cabin applications such as infotainment controllers and advanced driver-assistance systems (ADAS) are examples that have stringent mission-critical test requirements over wide operating temperature ranges.

5G试验

Amkor customers are developing 5G compliant products for two distinct applications, 5G base stations and 5G user equipment. The test requirements are different for each. With the implementation of 5G specifications for small cells, the relative 5G base station product volume is expected to increase by a couple of orders of magnitude. Both 5G base station and user equipment product test challenges include higher power ranges, higher download data rates, lower latency and an order of magnitude increase in the number of I/O channels for multiple-input, multiple-output (MIMO) and channel aggregation support. The U.S. Federal Communications Commission (FCC) approved the FR2 carrier frequency range between 24 GHz and 52 GHz that attenuates far more rapidly in air than the sub 6 GHz frequency range. These high-level test requirements are all relatively new to the RF test industry.

ATE供应商继续满足现有和预计为其客户开发竞争性测试解决方案的技术预期。一个例子是IC包装,其集成了天线结构。在包装或天线上测试天线(AIP / AOP)产品3.要求亚马逊与处理程序制造商实施,以实现机电解决方案,以实现将所需数量的发送和接收(TX和RX)通道进行源或捕获RF能量(OTA)并将其转换为导电能量以允许测试人员有效地测试部分所需的规格精度。

Fig. 3:5G测试应用程序。(来源:IEEE)。

AI Test

AI and ML processors are no different than other high-performance processors and their associated test requirements. However, the data rate and logic levels are increasingly challenging. The most popular test interfaces on these processors include PCIe, Ethernet (IEEE 802.3), display and memory. Other high-speed interfaces include MIPI DigRF variants, JESD204B/C, USB 3.x, Thunderbolt and proprietary implementations. Today, most of these interfaces are targeted to address effective data rates up to 32 Gbps. More recently, an ATE with pin electronics card (PEC) instrumentation has a data rate up to 2.5 Gbps, well within that capability. Typical DFx and test methodologies tackle production testing with a Tx to Rx loopback to test the physical layer (PHY) and scan to test the I/O logic for manufacturing defects.

Fig. 4:典型(AI)处理器及其数字高速测试接口。

汽车Test

汽车electronic products have a significant amount of digital content for logic control and infotainment, analog and sensor products for system status reporting and 5G RF content for advanced driver-assistance systems (ADAS) including autonomous driving. Product test requirements are evolving and challenging due to a wide operating temperature range, high bandwidth and low latency RF carrier frequencies in the 77 GHz to 81 GHz frequency range.

摘要

作为领先的Osat供应商,Amkor的测试能力和能力为客户提供外包测试和测试生产服务,为各种产品提供了优势。这些服务解决了测试挑战,特别是5G,AI和汽车ADAS产品。因此,测试服务继续成为客户的交钥匙服务加强供应链管理。

工具书类

  1. Amkor Device Packages
  2. 摩尔定律
  3. 包装/天线上的天线


About the Author

Vineet Pancholi,SR Director Test技术,Amkor Technol狗万注册地址ogy,Inc。在坦佩,AZ。Vineet于2019年1月加入了Amkor,目前为5G RF和高速数字生产测试方法提供了测试技术开发。在加入Amkor之前,Vineet在Microchip技术进行了测试开发中。此前,他在英特尔在英特尔度过了19年的一系列测试角色,包括测试仪供应商管理,测试技术开发(烧坏,最终和系统级测试)和RF测试仪建筑师。Vineet持有半导体器件测试人员专利,并在亚利桑狗万滚球官网那州立大学赢得了硕士学位的物理和电气工程学位。